Features of Fuji Mounter NXT-M6III:
1. Increased productivity.
The high-speed XY manipulator and tape feeder and the newly developed camera "Fixed On-the-fly camera" can improve the mounting capability of all components, from small components to large-shaped components.
In addition, after using the new high-speed head "H24 head", the component placement capacity of each module is up to 35,000CPH *, which is about 35% higher than NXT II.
2. Corresponding to 03015 components, placement accuracy ± 25μm *
NXT III can not only support the smallest 0402 components used in production, but also mount the next-generation 03015 ultra-small components.
In addition, by adopting a more rigid machine structure than the existing models, original servo control technology and component image recognition technology, the industry's top * small chip placement accuracy can be achieved: ± 25μm * (3σ) Cpk ≧ 1.00
3. Improve operability.
Inherited the GUI operating system that does not require language, which was highly praised on NXT series machines, adopted a new touch screen and updated the screen design.
Compared with the existing operation system, it reduces the number of keystrokes, and at the same time facilitates the selection of subsequent instructions, which not only improves the operability but also reduces the operation errors.
4. It has high compatibility.
The main units such as the work head, nozzle placement table, feeder and tray unit used in NXT II, the main unit such as the batch station bracket and the batch station bracket, etc. can be replaced intact Used in NXT III.
Target circuit board size (LxW):
48mm × 48mm ~ 534mm × 510mm (Dual transport rail specification)
48mm × 48mm ~ 534mm × 610mm (single transport rail specification)
* Maximum 280 mm for dual transport rails (W), and single transport rail transport when it exceeds 280 mm.
Number of components: MAX45 type (8mm tape conversion)
Circuit board loading time:
Double handling rail: O sec during continuous operation, single handling rail: 3.4 sec (M6 III modules are transported between modules)
Module width: 645mm
Machine size: L: 1295mm (M3III × 4, M6III × 2) / 645mm (M3III × 2, M6III) W: 1900.2mm H: 1476mm
Mounting accuracy / coating position accuracy (reference positioning point reference): * The placement accuracy is the measurement result under our company ’s conditions.
H24G: ± 0.025mm (standard mode) /±0.038mm (production priority mode) (3σ) cpk ≧ 1.00
V12 / H12HS: ± 0.038 (± 0.050) mm (3σ) cpk ≧ 1.00
H08M / H04S / H04SF: ± 0.040mm (3σ) cpk ≧ 1.00
H08 / H04 / OF: ± 0.050mm (3σ) cpk ≧ 1.00
H02 / H01 / G04: ± 0.030mm (3σ) cpk ≧ 1.00
H02F / G04F: ± 0.025mm (3σ) cpk ≧ 1.00
GL: ± 0.100mm (3σ) cpk ≧ 1.00
Capacity: * The value of capacity is the measurement result under the conditions of the company.
H24G: 37,500 (production priority mode) / 35,000 (standard mode) cph
V12: 26,000 cph
H12HS: 24,500 cph
H08M: 13,000 cph
H08: 11,500 cph
H04: 6,500 cph
H04S: 9,500 cph
H04SF: 10,500 cph
H02: 5,500 cph
H02F: 6,700cph
H01: 4,200 cph
G04: 7,500 cph
G04F: 7,500 cph
OF: 3,000 cph
GL: 16,363 dph (0.22sec / dot)
Image element:
H24G: 0201 ~ 5mm × 5mm Height: Max 2.0mm
V12 / H12HS: 0402 ~ 7.5mm × 7.5mm Height: Max 3.0mm
H08M: 0603 ~ 45mm × 45mm height: maximum 13.0mm
H08: 0402 ~ 12mm × 12mm Height: Maximum 6.5mm
H04: 1608 ~ 38mm × 38mm height: maximum 9.5mm
H04S / H04SF: 1608 ~ 38mm × 38mm height: maximum 6.5mm
H02 / H02F / H01 / 0F: 1608 ~ 74mm × 74mm (32mm × 180mm) Height: Maximum 25.4mm
G04 / G04F: 0402 ~ 15mm × 15mm height: maximum 6.5mm
Number of nozzles: 12
Capacity (cph): 25,000 components with or without confirmation function ON: 24,000
Image element size (mm): 0402 ~ 7.5 × 7.5 height: maximum 3.0mm
Mounting accuracy (based on the reference positioning point): ± 0.038 (± 0.050) mm (3σ) cpk ≧ 1.00
* ± 0.038mm is the result of mounting (high precision adjustment) of rectangular chip components under the best conditions of our company.
Number of nozzles: 4
Capacity (cph): 11,000
Image element size (mm): 1608 ~ 15 × 15 height: maximum 6.5mm
Mounting accuracy (based on the reference positioning point): ± 0.040mm (3σ) cpk ≧ 1.00
Number of nozzles: 1
Capacity (cph): 47,000
Image element size (mm): 1608 ~ 74 × 74 (32 × 100) height: maximum 25.4mm
Mounting accuracy (based on the reference positioning point): ± 0.030mm (3σ) cpk ≧ 1.00
Intelligent feeder: corresponding to 4 ? 8 ? 12 ? 16 ? 24 ? 32 ? 44 ? 56 ? 72 ? 88 ? 104mm width tape
Tube feeder: 4 ≦ component width ≦ 15mm (6 ≦ material tube width ≦ 18mm), 15 ≦ component width ≦ 32mm (18 ≦ material tube width ≦ 36mm)
Tray unit: Corresponding tray size 135.9 × 322.6mm (JEDEC specification) (Tray unit-M), 276 × 330mm (Tray unit-LT), 143 × 330mm (Tray unit-LTC)
Options:
Tray feeder, PCUII (feeding bracket replacement unit), MCU (module replacement unit), management computer placement table, FUJICAMXAdapter, Fujitrax