Features of Fuji Mounter NXT-M6IIIc Modular High-speed Multi-function Mounter:
1. Realized the industry's highest productivity per unit area
NXT IIIc realizes an extremely compact type with a module area of 0.46m2.
All inherited the concept of NXT III, which increased the area productivity by about 34% and achieved the highest area productivity in the industry. (81,300cph / m2)
* August 2015 survey by our company.
2. It is possible to add components without stopping the machine.
NXT II and NXT IIIc can be loaded and unloaded during production, so it is not necessary to stop the machine to replenish components.
For the tray components, the components can also be supplemented in production.
We have prepared various tools that can also be used for splicing materials.
對(duì)象電路板尺寸(LxW):
48mm×48mm~534mm×290mm(雙搬運(yùn)軌道規(guī)格)
48mm×48mm~534mm×380mm(單搬運(yùn)軌道規(guī)格)
*雙搬運(yùn)軌道(W)時(shí)最大170 mm, 超過(guò)170mm時(shí)變?yōu)閱伟徇\(yùn)軌道搬運(yùn)。
元件搭載數(shù):MAX45種類(8mm料帶換算)
電路板加載時(shí)間:
雙搬運(yùn)軌道:連續(xù)運(yùn)轉(zhuǎn)時(shí)O sec, 單搬運(yùn)軌道: 3.4 sec(M6 IIIc各模組間搬運(yùn))
模組寬度:645mm
機(jī)器尺寸:L:1295mm(M3 III×4, M6 III×2) / 645mm(M3 III×2, M6 III)W:1900.2mm H:1476mm
貼裝精度/涂敷位置精度(基準(zhǔn)定位點(diǎn)基準(zhǔn)):*貼裝精度是在本公司條件下的測(cè)定結(jié)果。
H24G:±0.025mm(標(biāo)準(zhǔn)模式)/±0.038mm(生產(chǎn)優(yōu)先模式) (3σ) cpk≧1.00
V12/H12HS:±0.038mm (3σ) cpk≧1.00
H08M/H04S/H04SF:±0.040mm (3σ) cpk≧1.00
H08/H04/OF:±0.050mm (3σ) cpk≧1.00
H02/H01/G04:±0.030mm (3σ) cpk≧1.00
H02F/G04F:±0.025mm (3σ) cpk≧1.00
GL:±0.100mm (3σ) cpk≧1.00
產(chǎn)能:*產(chǎn)能的數(shù)值是在本公司條件下的測(cè)定結(jié)果。
H24G:37,500(生產(chǎn)優(yōu)先模式)/35,000(標(biāo)準(zhǔn)模式) cph
V12:26,000 cph
H12HS:24,500 cph
H08M:13,000 cph
H08:11,500 cph
H04:6,500 cph
H04S:9,500 cph
H04SF:10,500 cph
H02:5,500 cph
H02F:6,700cph
H01:4,200 cph
G04:7,500 cph
G04F:7,500 cph
OF:3,000 cph
GL:16,363 dph(0.22sec/dot)
対象元件:
H24G:0201~5mm×5mm 高度:最大2.0mm
V12/H12HS:0402~7.5mm×7.5mm 高度:最大3.0mm
H08M:0603~45mm×45mm 高度:最大13.0mm
H08:0402~12mm×12mm 高度:最大6.5mm
H04:1608~38mm×38mm 高度:最大9.5mm
H04S/H04SF:1608~38mm×38mm 高度:最大6.5mm
H02/H02F/H01/0F:1608~74mm×74mm(32mm×180mm) 高度:最大25.4mm
G04/G04F:0402~15mm×15mm 高度:最大6.5mm
智能供料器:對(duì)應(yīng)4?8?12?16?24?32?44?56?72?88?104 mm 寬度料帶
管裝供料器:4≦元件寬≦15mm(6≦料管寬≦18mm), 15≦元件寬≦32mm(18≦料管寬≦36mm)
料盤(pán)單元:對(duì)應(yīng)料盤(pán)尺寸 135.9 × 322.6mm(JEDEC規(guī)格)(料盤(pán)單元-M), 276×330 mm (料盤(pán)單元-LT), 143×330 mm (料盤(pán)單元-LTC)
選項(xiàng):
料盤(pán)供料器、PCU IIc(供料托架更換單元)、PSU IIc(料站托架置放臺(tái))、MCU IIc (模組更換單元)、MCU IIc (模組置放臺(tái))、管理電腦置放臺(tái)、FUJI CAMX Adapter、Fujitrax